Experimental Investigation of NBTI Degradation in Power VDMOS Transistors Under Low Magnetic Field

dc.contributor.authorTAHI, Hakim
dc.contributor.authorTahanout, Cherifa
dc.contributor.authorBOUBAAYA, Mohamed
dc.contributor.authorDjezzar, Boualem
dc.contributor.authorMerah, Sidi Mohammed
dc.contributor.authorNadji, Bacharia
dc.contributor.authorSAOULA, Nadia
dc.date.accessioned2021-01-20T12:15:08Z
dc.date.available2021-01-20T12:15:08Z
dc.date.issued2017
dc.description.abstractIn this paper, we report an experimental evidence of the impact of applied a low magnetic field (B <; 10 mT) during negative bias temperature instability (NBTI) stress and recovery, on commercial power double diffused MOS transistor. We show that both interface (ANit) and oxide trap (ANot) induced by NBTI stress are reduced by applying the magnetic field. This reducing is more pronounced as the magnetic field is high. However, the dynamic of interface trap during stress and recovery phase is not affected by the applied magnetic field. While, the dynamic of oxide trap is affected in both stress and recovery phases.en_US
dc.identifier.otherINSPEC Accession Number: 16725049
dc.identifier.otherDOI: 10.1109/TDMR.2017.2666260
dc.identifier.urihttps://ieeexplore.ieee.org/document/7847316
dc.identifier.urihttps://dspace.univ-boumerdes.dz/handle/123456789/6187
dc.language.isoenen_US
dc.publisherIEEE Transactions on Device and Materials Reliability ( Volume: 17, Issue: 1, March 2017)en_US
dc.relation.ispartofseriesIEEE Transactions on Device and Materials Reliability ( Volume: 17, Issue: 1, March 2017);p.p. 99 - 105
dc.subjectNBTI degradationen_US
dc.subjectParamagnetic defectsen_US
dc.subjectLow magnetic fielden_US
dc.titleExperimental Investigation of NBTI Degradation in Power VDMOS Transistors Under Low Magnetic Fielden_US
dc.typeArticleen_US

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