On the Circuit-Level Reliability Degradation Due to AC NBTI Stress

dc.contributor.authorChenouf, Amel
dc.contributor.authorDjezzar, Boualem
dc.contributor.authorBenabdelmoumene, Abdelmadjid
dc.contributor.authorTahi, Hakim
dc.date.accessioned2021-04-19T11:05:11Z
dc.date.available2021-04-19T11:05:11Z
dc.date.issued2016
dc.description.abstractIn this paper, an experimental analysis of the impactof dynamic negative bias temperature instability (NBTI) stresson the CMOS inverter dc response and temporal performanceis presented. We analyzed the circuit behavior subjected to acNBTI in the prospect to correlate the induced degradation withthat seen at PMOS device level. The results revealed that, whileac NBTI-induced shift of the inverter features shows both voltageand temperature dependence, it does not always exhibit stresstime dependence. Indeed, the time exponentnis found to dependon both voltage and temperature. The analysis of such behaviorwhen correlated with the PMOS threshold shift points towardthe coexistence of more than one physical mechanism behindthe degradation, where one mechanism could dominate the otherunder certain stress conditions. Depending on these conditions,circuit lifetime could be more or less affecteden_US
dc.identifier.uriDOI:10.1109/TDMR.2016.2578040
dc.identifier.urihttps://dspace.univ-boumerdes.dz/handle/123456789/6867
dc.language.isoenen_US
dc.publisherIEEE Transactions on Device and Materials Reliabilityen_US
dc.relation.ispartofseriesIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, Vol. 16, N°. 3(2016);
dc.subjectAC NBTIen_US
dc.subjectNBTI characterizationen_US
dc.subjectCMOS in-verter reliabilityen_US
dc.subjectperformance analysisen_US
dc.subjectstress time dependenceen_US
dc.subjectinterface statesen_US
dc.subjecthole trappingen_US
dc.titleOn the Circuit-Level Reliability Degradation Due to AC NBTI Stressen_US
dc.typeArticleen_US

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