Measurement of Square Resistance In Situ of SnO2: F Thin Film With Annealing at High Temperature Under Air

Abstract

Thin films of fluorine doped tin oxide (SnO2: F), deposited by spray pyrolysis on silicon substrate, were characterized by the method of four points probe in situ during annealing at high temperature under air. The evolution of square resistance (in situ) with the annealing temperature was interpreted in terms of competition between electronic conduction and ionic conduction. A square resistance of 136�/□ is measured before annealing and after annealing at 900°C, the square resistance increases appreciably to reach 40k�/□. This increase is explained by the absorption of oxygen at the films surface and an increase in SiO2 thickness at interface SnO2/Si